Method of decorating glass plates



(No Model.)

S. PAINI.

METHOD OF DECORATING GLASS PLATES. No. 543,889. Patented Aug. 6, 1895.

UNITED STATES PATENT OFFICE.

SILVIO 'PAINI, OF ST. LOUIS, MISSOURI.-

METHOD OF DECORATING GLASS PLATES.

SPECIFICATION forming part of Letters Patent No. 543,889, dated August6, 1895.

Applicationfiled February 11, 1895. vSerial No. 537,965. (No specimens.)

.To all whom it may concern.-

Be it known that I, SILVIO PAINI, of the city of St. Louis, State ofMissouri, have invented certain new and useful Improvements in Methodsof Decorating Glass Plates, of which the following is a full, clear, andexact description, reference being had to the accompanying drawings,forming a part hereof.

My invention relates to the method of decorating glass plates; and itconsists in the novel features of construction hereinafter described andclaimed.

In the drawings, Figure l is a plan view of a stencil such as I employin carrying out my invention. Fig. 2 is a plan view of said stencilapplied to a plate that is to be decorated. Fig. 3 is a longitudinalsectional View of a section of glass plate, the same having astencil-plate located thereon, and showing the design in'said platefilled with a compound- Fig. 4. is a view in perspectiveshowing thestencil as it is being removed from the plate, and the compound I use infilling in said stencil in position upon said plate. Fig. 5 is alongitudinal sectional view of a plate, the same having the compound inposition thereon and before the same is subjected to the etching orcutting-out process. Fig. 6 is a longitudinal sectional view of theglass plate, the same having been stenciled by myimproved method andmeans and after A the same has been subjected to or acted upon by asuitable acid. Fig. 7 is a longitudinal sectional view of a glass plate,the same having'been prepared by my improved means and method and afterthe Same has been subjected to the process commonly known asthesand-blast. Fig. 8 is alongitudinal sectional View of a glass plate,the same having been stenciled by my improved method and means and acoating or layer of chipping compound applied to the surface of saidplate. Fig. 9 is a longitudinal sectional view of the plate seen in Fig.8, but with a second stencil located upon the chipping compound andcoinciding with the stencil that is located directly upon the face ofthe glass plate. Fig. 10 is a longitudinal sectional view of a glassplate such as seen in Figs. 8 and 9, the same having been stenciled bymy improved means and method and subjected to the chipping process.

Similar numerals refer to similar parts throughout the several views.

1 indicates the section or plate of glass, which maybe properly termedthe work in the succeeding description. When it is desired to decorate apiece of work by subjecting the same to the action of acid, thesandblast process, or by chipping, the letter, figure, or design, suchas 2, that it is desired shall appear in relief upon the plate or work1, is stenciled or cut from a thin metallic or paper sheet 3, and saidstencil so formed is located as desired upon the work.

When decorating or etching by the action of acid after the stencil isformed, I prepare a compound in approximately the following proportions:one part beeswax, one part vaseline, one part stearine, and two partsasphaltum. These are dissolved by heating and ground and mixed in anordinary grindingmachine and when thoroughly mixed and commingled andready for use should be of the consistency of ordinary butter. With apalette-knife, or any suitable means, I now apply the so-formed compounddirectly to the stencil, which is located upon the work at the properpoint, and thoroughly fill all the stenciled or cut-out portions of thedesign, thereby locating said compound directly upon the work. Thisbeing done the stencil-plate 3 is carefully removed from the work andthe design of said stencil is thus formed by the compound in relief uponthe work. After the compound has been allowed to dry a certain length oftime the plate is ready for the bath, or to be subjected to the actionof hydrofluoric acid. The acid will act upon the entire surface of thework not covered or protected by the compound, and therefore when theplate has been removed from the bath or acid and the compound washedfrom the surface of the work with ordinary kerosene and water the designwill appear upon the surface of said work in relief, and thus thedesired result is obtained.

When the work is subjected to the sand-blast process the desired designis stenciled or cut in the plate in the manner previously described andlocated directly upon the work; but the compound that is applied to saidwork through the stencil consists of the following ingredients in properproportions:

ICO

common glue dissolved or liquefied by hot water, one part; whiting, onepart; glycerine, one part. These ingredients are thoroughly mixedand'commingled and ground in an ordinary grinding-machine and when readyto be applied to the stencil are of the consistency of ordinary butter.Vith a palette-knife, or any suitable means, this compound so formed isapplied to the work, as previously described, and the stencil removed.After the compound upon the work has dried a sufficient length of timethe work is placed in the sandblast apparatus and the entire exposedsurface of the work or that not covered and protected by the compoundwill be cut and removed by said process, and when the compound is washedfrom the work with water the design appears upon said work in relief.

The glycerine in this compound tends to keep said compound in a plasticstate, acts as a preservative for the same, and does not allow saidcompound to chip away from the work when the compound has been dried andsaid work is being acted upon by the sand-blast process.

hen it is desired to ornament the work by the chipping process, thestencil is applied to the work and the compound of glue, whiting, andglycerine, as previously described, is applied and the stencil-plateremoved. The chipping compound (indicated by the numeral 4 in Figs. 8and 9) is now placed upon the entire surface of the work and thespecially-formed compound that was previously stenciled upon said work.While the chipping compound is yet soft and plastic, the stencil isagain applied to the work in such a manner as that the design formed insaid stencil will coincide with the previouslystenciled design upon saidwork. The compound of glue, whiting, and glycerine is now applied to thestencil and necessarily is located directly upon the chipping compound,that in turn is located upon the compound first stenciled upon the work.

Upon the removal of the stencil-plate 3 the two coinciding stencileddesigns will be left upon the work, between which is a coating or layerof the chipping compound, and the entire surface of the glass notcovered and protected by the first design is covered and adapted to beacted upon by the chipping compound. By thus locating my compound uponeach side of the chipping compound said chipping compound is preservedin a soft and plastic condition and not allowed to contact with thesurface of the work where the design has been stenciled thereon. Hence,when said chipping compound has acted upon the surface of the glass, andtogether with my protecting compound is washed therefrom, the surface ofthe work protected by the stenciled design appears intact and in relief,the edges of said design appearing very sharp and clear cut.

The method of coincidingly stenciling the the designs upon the work andthe manner in which the chipping compound is applied to said work may bemore clearly understood by referring to Figs. 8 and 9, the work finishedby this process appearing as clearly shown in Fig. 10.

My compounds are very easily, cheaply, and expeditiously formed and,being plastic, are capable of being very easily work ed'and stenciledupon the surface of the work.

hen said compounds are dried upon the work, they very efficientlypreserve the surface of the work upon which they are located and allowvery clear sharp edges or lines to be formed on the surface of said workby the acid, sand-blast, and chipping processes.

By the use of a stencil in locating the designs upon the work much timeand labor are saved in preparing the work for the various processes, anda great number of pieces of work may be prepared in a comparativelyshort length of time.

What I claim is- The herein described process of ornamenting glass oranalogous plates, which consists in stenciling the desired design uponthe work with a compound of glue, whiting and glycerine in the properproportions, then 10- cating upon the surface ofsaid work and stencileddesign a suitable chipping compound, then re-stenciling upon thechipping compound the design so as to coincide with the first stencileddesign, then allowing said chipping compouud to act in the usual manner,and finally washing said chippingcompound and stenciled designs from thesurface of the work.

In testimony whereof I aliix my signature in presence of two witnesses.

SILVIO PAINI. \Vitnesses E. E. LONGAN, JOHN C. HIGDON.

